- Interface : DDR4
- Type de module DIMM : SODIMM
- Fréquence : 2400 / 2666 / 3200 MHz
- Capacités variées : 4 Go/8 Go/16 Go/32 Go
- Température de fonctionnement : 0-75°C
- Température de stockage : -40-75°C
- Tension: 1,2 V
Série DDR4 SODIMM
- Le roi Dian Série DDR4 SODIMM
- Amélioration des performances - DDR4 laptop memory offers improved data transfer rates and efficiency compared to DDR3 memory, enhancing overall system performance.
- Faible consommation d’énergie - DDR4 memory operates at lower voltage levels, contributing to reduced power consumption, which is essential for laptops to maximize battery life during both gaming and work tasks.
- Fiabilité et endurance - Le roi Dian DDR memory adopts 6-layer PCB board design to ensure product stability and high-performance transmission and adopts excellent A-level Nor Flash to ensure product quality and compatibility.
- Capacités élevées - Available in various capacities, DDR 4 Go, DDR 8 Go, DDR 16 Go, DDR 32 Go, allowing for efficient multitasking, resource-intensive gaming, and professional software use.
- Fabricant de mémoire pour ordinateur portable - Le roi Dian uses strict incoming inspection standards, professional production processes and strict quality management methods to provide a series of Mémoire DDR products for long-term use with wide compatibility, high stability, high read-write performance, and excellent compatibility with mainstream computing platform solutions.
| Série | Série DDR4 SODIMM | |||
| Marque | Le roi Dian | |||
| Capacité | 4 Go | 8 Go | 16 Go | 32 Go |
| Numéro de modèle | DDR4-NB-4 Go | DDR4-NB-8 Go | DDR4-NB-16 Go | DDR4-NB-32 Go |
| Vitesse / fréquence de la mémoire | 2400/2666MHz | 2400/2666/3200MHz | 2666/3200MHz | 2666/3200MHz |
| Bande passante mémoire (Go/s) | 19200/21300 | 19200/21300/25600 | 21300/25600 | 21300/25600 |
| Rang (1Rx8/2Rx8/8Rx4) | 1Rx8 | 1Rx8 | 2Rx8 | 2Rx8 |
| Latence CAS | Référence : CL17-17-17-39 | Référence : CL19-19-19-43 | Référence : CL19-19-19-43 | |
| No. of Memory IC | 4//8//16 | |||
| Operating Tension | 1,2 V | |||
| Consommation d’énergie | 3W | |||
| Poids net (g) | 15 grammes | |||
| Poids brut (g) | 40g | |||
| Contrôleur IC | NON | |||
| Overclock Support (OUI / NON) | NON | |||
| Dissipateur thermique / Dissipateur de chaleur | NON | |||
| ECC (Error Correction Code) (OUI/NON) | NON | |||
| Nombre de broches | 260 | |||
| Prise en charge OEM/ODM | OUI | |||
| Type de mémoire de l’ordinateur (DRAM/SDRAM) | DRAM | |||
| Température de fonctionnement | 0-70°C | |||
| Température de stockage | -40~85°C | |||
| Garantie | 3 ans | |||
| Facteur de forme | SODIMM | |||
| No. of Memory Channels (Simple/Double) | (Simple/Double) | |||
| Dimensions du produit (L x P x H) en mm | 70x30x3,5 mm | |||
| Mémoire tamponnée/non tamponnée | Mémoire sans tampon | |||
| Memory IC Marque | Micron/Samsung/Sk Hynix | |||